Registry › XF-BUWP3VM-I
XF-BUWP3VM-I
Framework ACTIVE

HKMC SGS Bond Framework Sep 2022

Document Metadata

Issuer
The Hong Kong Mortgage Corporation Limited
Document Type
Framework
Publication Year
2022
Retrieved
31 March 2026
Source
Contact XFID for Access
Record ID
XFBUWP3VMI
Validation
Inferred by XFID

Verification

XFIDs are content-addressed: these SHA-256 fingerprints let anyone confirm a copy of this document is identical to what XFID retrieved on 31 March 2026 — independent of this registry.

SHA-256 (file bytes)
4c8449dabccc78bf223e03e98ff0cd5b3b321eda4e3a84295480db950d6581bd
SHA-256 (canonical content)
e5fc7996a747be1af6aeb0e34d7f610a108b58cf8c84f2a54eeea471b1f7e9c6
File
745 KB

The canonical-content hash survives re-downloads, URL moves, and byte-level re-encodes: the same disclosure text always resolves to this XFID.

Related Documents

Version History

Retrieved Action Size
31/03/2026 INITIAL 745 KB latest

How to Cite This Record

Use the XFID in citations to create a stable, permanent reference that resolves to this registry entry regardless of the source URL.

Academic / report citation
The Hong Kong Mortgage Corporation Limited (2022). HKMC SGS Bond Framework Sep 2022. XFID: XF-BUWP3VM-I. Retrieved from https://xframework.id/XFBUWP3VMI
Identifier only
XF-BUWP3VM-I

Press Coverage

News and trade press articles about this issuer, tracked in the registry.